Electronics Forum | Wed Feb 07 07:58:58 EST 2007 | ayelet
Thank you guys. So to summarize - no spec, just need to have decent cleaning... Are you familiar with dust events that caused burning of test stations ? Thanks Ayelet
Electronics Forum | Thu Feb 12 11:57:59 EST 2009 | jmiller
i have searched the forum for hours. read all the threads that deals with cleanliness and ionic testing. (http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=40295) (http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=22603) (http://www.
Electronics Forum | Tue Jan 23 10:15:44 EST 2007 | slthomas
J-STD-001C just requires that the area not be so dirty as to contaminate your product, tools, workspace, etc. If you start counting particles, you're into cleanroom territory. Do a search on ISO 14644-1 for specifics. Actually Wikipedia does a ni
Electronics Forum | Wed Mar 12 18:30:22 EDT 2008 | genaro_silvera
Hello Steve: I work at Navico, a company that makes GPSs and Sonars among other products for recreational fishing. I want to know if our SMT, Thru-Hole and Final Assembly areas need to be in a cleanroom environment? I've worked in another companies
Electronics Forum | Mon Feb 05 10:12:32 EST 2007 | slthomas
The use of booties isn't required per se, just considered a standard step necessary to reach the 10,000 target. You also need to vacuum (central vac system, NOT exhausting into the room) daily, mop weekly, have a one piece floor, blah, blah, blah....
Electronics Forum | Tue Aug 14 23:58:19 EDT 2001 | Glen Brian
We are using the new auto-dipping machine for LED solder dipping and dragging. The flux is water-soluble flux and the solder is 63/37 at 250 deg. C. Two weeks ago we exchanged the pot with new 63/37 solder. About a week, we found that the high level
Electronics Forum | Wed Aug 15 16:04:23 EDT 2001 | davef
First, responding to your question � Several things on copper dissolution in solder are: * A 50um copper wire will dissolve in 60Sn / 40Pb solder at: - 200�C solder in 55 seconds; - 250�C solder in 20 seconds; - 300�C solder in 5 seconds; - 350�C so
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Tue Nov 25 16:26:43 EST 2003 | tdurston
We are trying to establish requirements and process controls for completed, cleaned SMT assemblies. We have problems with our high impedance circuits (100 meg ohms) being affected by residue. Some boards require additional cleaning cycles to remove
Electronics Forum | Fri Dec 17 18:21:43 EST 1999 | Clarissa L. Ortner
We are a small start up. We will be buying a stenciling machine and semi automated pick and place. ( We have the oven) We are presently stenciling without any assit and loading leadless parts only(no fine pitch) by hand. We need to improve thrupu
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